Intel has taken another step toward next-generation chip manufacturing by using ASML’s High Numerical Aperture (High-NA) Extreme Ultraviolet (EUV) lithography machine to help produce parts of its upcoming Panther Lake laptop processors. The move marks an important milestone as the semiconductor industry prepares for more advanced chipmaking technologies.
Intel began testing ASML’s High-NA EUV systems in 2024 after receiving the first machine at its Hillsboro, Oregon, research and development facility. According to ASML, the company is now using the advanced equipment to manufacture selected layers of Panther Lake chips. This allows Intel and ASML to collect production data and improve the performance of the new technology before wider deployment.
The High-NA EUV machine is designed to print extremely small circuit patterns onto semiconductor wafers, making it possible to produce faster, more efficient chips with higher transistor density. As chipmakers continue shrinking chip features to improve performance, High-NA technology is expected to become increasingly important.
However, the equipment comes with significant challenges. Each High-NA EUV machine costs around $400 million, roughly twice the price of ASML’s standard EUV systems. The technology is also more complex to integrate into large-scale manufacturing, making gradual adoption a practical approach.
Intel is producing Panther Lake processors using its 18A manufacturing process, which already relies on ASML’s standard EUV lithography tools. By introducing the High-NA system for specific production layers, Intel aims to refine its manufacturing process while preparing for future generations of advanced chips.
Although Intel declined to comment on the announcement, the collaboration with ASML highlights the company’s commitment to strengthening its semiconductor manufacturing capabilities and remaining competitive in the rapidly evolving global chip industry.
